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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
R90E.pdf
Mar.4,2014
! Caution/Notice
Continued from the preceding page.
(2) Reflow soldering conditions
The following figure and table show our recommended
reflow profile.
(a) Insufficient preheating may cause a crack on
Temp. (°C)
270°C
250°C
ceramic body. The temperature difference between
preheat and peak should be control within 100°C to
prevent this.
220°C
Limit Profile
(b) The excessive soldering conditions may cause
dissolution of metallization or deterioration of
solder-wetting on the external electrode.
(c) Rapid cooling by dipping in solvent or by other
180°C
150°C
Standard Profile
means is not recommended.
(d) Please evaluate it on your condition if you will do
90±30s
30 to 60s
90s
Time (s)
mounting using not applying condition to the
above-mentioned.
Standard Profile
Limit Profile
Preheat
150 to 180°C, 90±30s
Soldering Time ( U 220°C)
Peak Temp.
Reflow Cycle
30 to 60s
250°C
Max. 2 times
90s
270°C
Max. 2 times
(3) There may be a risk of unexpected failures
(tombstone, insufficient solder-wetting, etc.) in the
mounting process, caused by the mounting conditions.
Please make sure that this product is correctly
mounted under specified mounting conditions.
93
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